The professional Luowei LW-SP3 flux paste is a high-quality solder alloy in paste form, specially designed for micro-soldering operations
and chip-level reballing on phone and computer motherboards. This premium consumable is formulated with an eco-friendly formula,
lead-free and halogen-free, featuring an ultra-fine and homogeneous texture that ensures excellent adhesion of solder balls,
without the risk of air bubble formation. For maximum safety of sensitive printed circuits, the paste has non-conductive properties,
extreme oxidation resistance, and ideal wettability, guaranteeing firm, clean, and stable solder joints over time.
Features:
- Net product quantity: 30 grams
- Melting temperature: 217 degrees C
- Chemical composition: Eco-friendly formula, lead-free, halogen-free, and completely odorless
- Physical properties: High viscosity, ultra-fine texture, optimal consistency, and high oxidation resistance
- Electrical properties: Non-conductive material (ensures total safety of components during melting)
- Advantages: Excellent wettability, prevents air bubble formation, and ensures long-lasting metal joints
- Application: Precision chip-level soldering, reballing, GSM service (mobile phones), and PC motherboard repairs