Presentation
| Product range | SS-101A Upgrade |
| Product type | BGA Instrument |
Sale package
| Pack | Blister |
| Content | BGA Instrument / Blades |
| Product status | New |
Sunshine SS-101A Upgrade BGA Tool
The Sunshine SS-101A Upgrade tool is specially designed for the safe and efficient removal of BGA chips (such as CPU or baseband)
from mobile phone motherboards. The set includes 27 ultra-thin blades and an ergonomic pen-shaped handle,
ideal for precision work in service. Made from high-quality copper and aluminum, processed through advanced lamination and grinding,
the tool offers high resistance, durability, and a comfortable user experience. The blades are thinner than solder points,
allowing easy insertion between the chip and PCB without damaging the pads or traces.
The double jaw opening design and compact shape allow precise handling, while the operating instructions recommend using
with a hot air station at a temperature between 340-360 degrees C and an air speed between 28-30.
Features:
- 27 blades + 1 pen-shaped handle
- Blades thinner than solder points
- Cross-opening design for efficient handling
- Premium materials: high-quality copper and aluminum
- Ideal for removing small components from the motherboard
- Does not affect copper, leaves no marks, and does not require excessive force